GENEVA, July 9 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布2丁目26番30号) filed a patent application (PCT/JP2024/046368) for "COMPOUND, POLYMERIZABLE COMPOUND, THERMOPLASTIC RESIN-CONTAINING COMPOSITION AND MOLDED BODY THEREOF, COMPOSITION FOR THERMOSETTING RESIN AND CURED PRODUCT THEREOF, OPTICAL MEMBER, AND LENS" on Dec 27, 2024. With publication no. WO/2025/143211, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the Intern...