GENEVA, March 25 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布2丁目26番30号) filed a patent application (PCT/JP2024/031226) for "ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE" on Aug 30, 2024. With publication no. WO/2025/057784, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the Intern...