GENEVA, April 1 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布2丁目26番30号) filed a patent application (PCT/JP2024/032600) for "ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN-FORMING METHOD, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE" on Sep 11, 2024. With publication no. WO/2025/063114, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...