GENEVA, March 25 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布2丁目26番30号) filed a patent application (PCT/JP2024/030066) for "ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE" on Aug 23, 2024. With publication no. WO/2025/057700, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) ...