INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIN, RESIST FILM, PATTERN FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD"

GENEVA, Feb. 17 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2024/024081) for "ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIN, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD" on Jul 03, 2024. With publication no. WO/2025/033036, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sy...