GENEVA, Oct. 27 -- FUJI POLYMER INDUSTRIES CO., LTD. (FUJIPOLY Bldg., 21-1, Meieki 5-chome, Nakamura-ku, Nagoya-shi, Aichi4500002), 富士高分子工業株式会社 (愛知県名古屋市中村区名駅五丁目２１番１号ＦＵＪＩＰＯＬＹビル) filed a patent application (PCT/JP2024/040488) for "THERMALLY CONDUCTIVE SILICONE RESIN COMPOSITION, METHOD FOR MANUFACTURING SAME, AND THERMALLY CONDUCTIVE SHEET" on Nov 14, 2024. With publication no. WO/2025/220256, the details related to the patent application was published on Oct 2...