GENEVA, Sept. 29 -- FUJI CORPORATION (19, Chausuyama, Yamamachi, Chiryu-shi, Aichi4728686), 株式会社ＦＵＪＩ (愛知県知立市山町茶碓山１９番地) filed a patent application (PCT/JP2024/010824) for "MOLDING DEVICE" on Mar 19, 2024. With publication no. WO/2025/196971, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SUZUKI Jun (c/o FUJI CORPORATION, 19, Chausuyama, Yamamachi, Chiryu-shi, Aich...