GENEVA, April 28 -- EVATEC AG (Hauptstr. 1a9477 Trubbach) filed a patent application (PCT/EP2024/079354) for "MEASURING DEVICE FOR MEASURING A THICKNESS OF A FILM OF MATERIAL DEPOSITED ON A SUBSTRATE AND FILM DEPOSITION APPARATUS WITH AT LEAST ONE SUCH MEASURING DEVICE" on Oct 17, 2024. With publication no. WO/2025/083132, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HERDE, Adrian (Hofacherstrasse 58634 Hombrechtikon), SCHUNGEL, Edmund (Schlappliweg 119470 Buchs)
Abstract:
A measuring device (6) for measuring a thic...