GENEVA, July 29 -- ELEPHANTECH INC. (4-3-8, Hatchobori, Chuo-ku, Tokyo1040032), エレファンテック株式会社 (東京都中央区八丁堀四丁目3番8号) filed a patent application (PCT/JP2025/000865) for "SHEET-LIKE NON-CONDUCTIVE FLEXIBLE SUBSTRATE MATERIAL CONVEYANCE DEVICE, SHEET-LIKE NON-CONDUCTIVE FLEXIBLE SUBSTRATE MATERIAL CONVEYANCE METHOD, SHEET-LIKE NON-CONDUCTIVE FLEXIBLE SUBSTRATE MATERIAL STACK, AND NON-CONDUCTIVE ANTI-ADHESION INSERTION SHEET" on Jan 14, 2025. With publication no. WO/2025/154702, the details related to the patent application was published on Jul 24, 2025.

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