GENEVA, Oct. 27 -- EIKYU CO., LTD. (3-39, Kashiwadahigashi-machi, Higashiosaka-shi, Osaka5770833), 株式会社Ｅｉｋｙｕ (大阪府東大阪市柏田東町３番３９号) filed a patent application (PCT/JP2025/013435) for "RESIN MOLDED BODY FOR REPELLING FLYING INSECT PESTS" on Apr 01, 2025. With publication no. WO/2025/220488, the details related to the patent application was published on Oct 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ARAI Dai (c/o Eik...