INTERNATIONAL PATENT: EHWA DIAMOND IND. CO., LTD., 이화다이아몬드공업 주식회사 FILES APPLICATION FOR "METHOD FOR DRESSING GANG SAW CUTTING TIP IN REAL TIME USING ABRASIVE MATERIALS"

GENEVA, July 3 -- EHWA DIAMOND IND. CO., LTD. (374 Nambu-daeroOsan-si,Gyeonggi-do 18145), 이화다이아몬드공업 주식회사 (경기도오산시남부대로 374) filed a patent application (PCT/KR2024/019941) for "METHOD FOR DRESSING GANG SAW CUTTING TIP IN REAL TIME USING ABRASIVE MATERIALS" on Dec 06, 2024. With publication no. WO/2025/135640, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RHEE, Dae-...