GENEVA, June 11 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2024/042211) for "TOP RING AND SUBSTRATE POLISHING DEVICE" on Nov 28, 2024. With publication no. WO/2025/115976, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KASHIWAGI, Makoto (c/o Ebara Corporation, 11-1, Han...