GENEVA, Sept. 17 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町11番1号) filed a patent application (PCT/JP2025/008368) for "SUBSTRATE POLISHING DEVICE, SUBSTRATE TREATMENT DEVICE, SUBSTRATE POLISHING METHOD, AND PROGRAM" on Mar 07, 2025. With publication no. WO/2025/187806, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invento...