GENEVA, Dec. 16 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2024/020231) for "PLATING APPARATUS AND PLATING METHOD" on Jun 03, 2024. With publication no. WO/2025/253449, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAKAHAMA, Shigeyuki (c/o Ebara Corporation, 11-1, Hane...