GENEVA, Feb. 17 -- DOWA METALTECH CO., LTD. (14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo1010021), ＤＯＷＡメタルテック株式会社 (東京都千代田区外神田四丁目１４番１号) filed a patent application (PCT/JP2024/027799) for "SILVER-PLATED MATERIAL, TERMINAL FOR ELECTRIC CONTACT, AND METHOD FOR PRODUCING SILVER-PLATED MATERIAL" on Aug 02, 2024. With publication no. WO/2025/033360, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system,...