GENEVA, Feb. 10 -- DOWA METALTECH CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡメタルテック株式会社 (東京都千代田区外神田四丁目１４番１号) filed a patent application (PCT/JP2025/026453) for "Cu-Ti-Al-BASED COPPER ALLOY SHEET MATERIAL, ELECTRONIC APPARATUS COMPONENT, CURRENT-CARRYING COMPONENT, AND HEAT DISSIPATION COMPONENT" on Jul 25, 2025. With publication no. WO/2026/028947, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Cl...