GENEVA, Oct. 19 -- DOWA METALTECH CO., LTD. (14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo1010021), ＤＯＷＡメタルテック株式会社 (東京都千代田区外神田四丁目１４番１号) filed a patent application (PCT/JP2025/013610) for "COPPER ALLOY SHEET MATERIAL, CURRENT-CARRYING COMPONENT, HEAT DISSIPATION COMPONENT, AND BOARD-TO-BOARD CONNECTOR" on Apr 03, 2025. With publication no. WO/2025/216160, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (I...