GENEVA, Dec. 9 -- DOWA ELECTRONICS MATERIALS CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡエレクトロニクス株式会社 (東京都千代田区外神田４丁目１４番１号) filed a patent application (PCT/JP2025/018811) for "SPHERICAL SILVER POWDER, METHOD FOR PRODUCING SPHERICAL SILVER POWDER, AND ELECTRICALLY CONDUCTIVE PASTE" on May 23, 2025. With publication no. WO/2025/249331, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Class...