GENEVA, May 6 -- DOWA ELECTRONICS MATERIALS CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡエレクトロニクス株式会社 (東京都千代田区外神田４丁目１４番１号) filed a patent application (PCT/JP2024/038217) for "SILVER POWDER AND RESIN-CURABLE ELECTROCONDUCTIVE PASTE" on Oct 25, 2024. With publication no. WO/2025/089418, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wo...