GENEVA, May 5 -- DOWA ELECTRONICS MATERIALS CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡエレクトロニクス株式会社 (東京都千代田区外神田４丁目１４番１号) filed a patent application (PCT/JP2024/037447) for "SILVER POWDER, PRODUCTION METHOD FOR SILVER POWDER, AND CONDUCTIVE PASTE" on Oct 21, 2024. With publication no. WO/2025/089239, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ...