GENEVA, May 6 -- DOWA ELECTRONICS MATERIALS CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡエレクトロニクス株式会社 (東京都千代田区外神田４丁目１４番１号) filed a patent application (PCT/JP2024/038215) for "SILVER POWDER, METHOD FOR PRODUCING SILVER POWDER, DEVICE FOR PRODUCING SILVER POWDER, AND RESIN-CURABLE CONDUCTIVE PASTE" on Oct 25, 2024. With publication no. WO/2025/089417, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the Internatio...