GENEVA, July 8 -- DOWA ELECTRONICS MATERIALS CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡエレクトロニクス株式会社 (東京都千代田区外神田４丁目１４番１号) filed a patent application (PCT/JP2024/038761) for "MIXED SILVER POWDER, METHOD FOR PRODUCING SAME, AND METAL PASTE FOR BONDING" on Oct 30, 2024. With publication no. WO/2025/142113, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which...