GENEVA, Feb. 25 -- DOW TORAY CO., LTD. (2-24, Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo1408617), ダウ・東レ株式会社 (東京都品川区東品川二丁目２番２４号) filed a patent application (PCT/JP2024/028464) for "THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, AND HEAT-DISSIPATING STRUCTURE" on Aug 08, 2024. With publication no. WO/2025/037579, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property ...