GENEVA, Jan. 6 -- DOW-MITSUI POLYCHEMICALS CO., LTD. (2-1, Yaesu 2-chome, Chuo-ku, Tokyo1040028), 三井・ダウ ポリケミカル株式会社 (東京都中央区八重洲二丁目２番１号) filed a patent application (PCT/JP2025/022758) for "RESIN COMPOSITION FOR SEALANT, SEALANT, LAMINATE, AND SKIN PACK PACKAGING BODY" on Jun 24, 2025. With publication no. WO/2026/004870, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by th...