INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, INSULATING MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD AND CAPSULE-LIKE MODIFIER"

GENEVA, Feb. 10 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/025530) for "THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, INSULATING MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND CAPSULE-LIKE MODIFIER" on Jul 17, 2025. With publication no. WO/2026/028822, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classi...