GENEVA, June 3 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2024/040398) for "THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING AGENT, SEMICONDUCTOR DEVICE, INSULATING MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD" on Nov 14, 2024. With publication no. WO/2025/110075, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, whic...