INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "LAMINATED FILM WITH GAS BARRIER PROPERTY, PACKAGING MATERIAL AND SEPARATION AND RECOVERY METHOD"

GENEVA, June 24 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2024/042088) for "LAMINATED FILM WITH GAS BARRIER PROPERTY, PACKAGING MATERIAL, AND SEPARATION AND RECOVERY METHOD" on Nov 28, 2024. With publication no. WO/2025/126849, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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