GENEVA, Jan. 5 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/018491) for "GAS BARRIER FILM AND PACKAGING BODY" on May 22, 2025. With publication no. WO/2026/004415, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KANDA Ryo (c/o DIC Corporation, Tokyo Plant, 35-58,...