INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "CURABLE RESIN COMPOSITION FOR PHOTOFABRICATION, CURED OBJECT AND THREE-DIMENSIONAL FABRICATED OBJECT"

GENEVA, Aug. 11 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/001065) for "CURABLE RESIN COMPOSITION FOR PHOTOFABRICATION, CURED OBJECT, AND THREE-DIMENSIONAL FABRICATED OBJECT" on Jan 16, 2025. With publication no. WO/2025/164319, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)...