INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, 国立大学法人九州大学 FILES APPLICATION FOR "EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF AND DISASSEMBLING METHOD"

Posted On: 2025-05-27

GENEVA, May 27 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号), KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (744, Motooka, Nishi-ku, Fukuoka-shi, Fukuoka8190395), 国立大学法人九州大学 (福岡県福岡市西区元岡７４４) filed a patent application (PCT/JP2024/037374) for "EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD" on Oct 21, 2024. With publication no. WO/202...

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INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, 国立大学法人九州大学 FILES APPLICATION FOR "EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF AND DISASSEMBLING METHOD"