GENEVA, May 4 -- DEYING INNOVATION (SHANGHAI) SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO., LTD. (Area A, 1st Floor, No. 17, Lane 399, Zhongxin Road, Xiaokunshan TownSongjiang District, Shanghai 201600), 德赢创新（上海）半导体设备技术有限公司 (中国上海市松江区小昆山镇镇中心路399弄17号一层A区) filed a patent application (PCT/CN2024/089766) for "CORRUGATED STRUCTURED PACKING MADE OF CLEAN PFA BY INJECTION MOLDING METHOD" on Apr 25, 2024. With publication no. WO/2025/086582, the details related to the patent appli...