INTERNATIONAL PATENT: DEXERIALS CORPORATION, デクセリアルズ株式会社 FILES APPLICATION FOR "SOLDER CONNECTION MATERIAL, METHOD FOR MANUFACTURING CONNECTION STRUCTURE AND CONNECTION STRUCTURE"

GENEVA, Jan. 27 -- DEXERIALS CORPORATION (1724 Shimotsuboyama, Shimotsuke-shi, Tochigi3230194), デクセリアルズ株式会社 (栃木県下野市下坪山１７２４) filed a patent application (PCT/JP2025/025305) for "SOLDER CONNECTION MATERIAL, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND CONNECTION STRUCTURE" on Jul 15, 2025. With publication no. WO/2026/018836, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...