GENEVA, May 27 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/039806) for "THERMOPLASTIC RELEASE FILM FOR SEMICONDUCTOR SEALING PROCESS" on Nov 08, 2024. With publication no. WO/2025/105301, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IZUMI E...