INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "SILICON NITRIDE POWDER, BORON NITRIDE POWDER, ALUMINUM NITRIDE POWDER, METHOD FOR PRODUCING NITRIDE POWDER, COMPOSITION FOR THREE-DIMENSIONAL MOLDING, MOLDED PRODUCT, SINTERED COMPACT AND METHOD FOR PRODUCING MOLDED PRODUCT"

GENEVA, Nov. 25 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/017172) for "SILICON NITRIDE POWDER, BORON NITRIDE POWDER, ALUMINUM NITRIDE POWDER, METHOD FOR PRODUCING NITRIDE POWDER, COMPOSITION FOR THREE-DIMENSIONAL MOLDING, MOLDED PRODUCT, SINTERED COMPACT, AND METHOD FOR PRODUCING MOLDED PRODUCT" on May 12, 2025. With publication no. WO/2025/239317, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was...