GENEVA, Sept. 30 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/010314) for "RESIN COMPOSITION FOR 3D PRINTER FILAMENT, 3D PRINTER FILAMENT, AND DEPOSITION MODEL" on Mar 18, 2025. With publication no. WO/2025/197876, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WI...