GENEVA, April 15 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/035475) for "RESIN COMPOSITION, INSULATING RESIN CURED PRODUCT, LAMINATE, AND CIRCUIT BOARD" on Oct 03, 2024. With publication no. WO/2025/075099, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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