INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "LIGASE CAPABLE OF HIGHLY ACCURATELY JOINING SEQUENCES HAVING NO MISMATCHED BASE PAIRS"

GENEVA, Sept. 29 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/005479) for "LIGASE CAPABLE OF HIGHLY ACCURATELY JOINING SEQUENCES HAVING NO MISMATCHED BASE PAIRS" on Feb 18, 2025. With publication no. WO/2025/197400, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...