INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "FIBER BUNDLE FOR ARTIFICIAL HAIR AND HAIR ACCESSORY PRODUCT"

GENEVA, June 11 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/041655) for "FIBER BUNDLE FOR ARTIFICIAL HAIR AND HAIR ACCESSORY PRODUCT" on Nov 25, 2024. With publication no. WO/2025/115809, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SAKAMOT...