GENEVA, April 29 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/037102) for "ALUMINA POWDER, RESIN COMPOSITION, AND ADHESIVE" on Oct 18, 2024. With publication no. WO/2025/084383, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NOGAMI, Naotsugu (...