GENEVA, Aug. 25 -- DAIYA SEIKI CO., LTD. (1-4-20, Osachi-Katama-cho, Okaya-shi, Nagano3940084), 株式会社ダイヤ精機製作所 (長野県岡谷市長地片間町一丁目４番２０号) filed a patent application (PCT/JP2024/005235) for "SURGICAL INSTRUMENT" on Feb 15, 2024. With publication no. WO/2025/173162, the details related to the patent application was published on Aug 21, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OMUR...