GENEVA, Sept. 16 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-shi, Osaka5300001), ダイキン工業株式会社 (大阪府大阪市北区梅田一丁目１３番１号 大阪梅田ツインタワーズ・サウス) filed a patent application (PCT/JP2025/007313) for "SHEET, COPPER-CLAD LAMINATE, CIRCUIT BOARD, AND PRODUCTION METHOD FOR SHEET" on Feb 28, 2025. With publication no. WO/2025/187577, the details related to the patent application was published on Sep 11, 2025.
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