GENEVA, Oct. 27 -- DAIHEN CORPORATION (1-11, Tagawa 2-chome, Yodogawa-ku, Osaka-shi, Osaka5328512), 株式会社ダイヘン (大阪府大阪市淀川区田川２丁目１番１１号) filed a patent application (PCT/JP2025/014453) for "LAMINATION MOLDING SYSTEM" on Apr 11, 2025. With publication no. WO/2025/220603, the details related to the patent application was published on Oct 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TSUTSUI, Kenta (c/o DAIHEN...