GENEVA, June 24 -- DAIDO KOGYO CO., LTD. (I-197, Kumasaka-machi, Kaga-shi, Ishikawa9228686), 大同工業株式会社 (石川県加賀市熊坂町イ１９７番地) filed a patent application (PCT/JP2024/027607) for "HIGH-TEMPERATURE MOLDING DIE" on Aug 01, 2024. With publication no. WO/2025/126553, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MINAMI, Takuto (c/o DAIDO KOGYO CO., LTD., I-197, Kumasaka-mac...