GENEVA, Jan. 6 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町3番1号) filed a patent application (PCT/JP2025/022833) for "MACROMOLECULAR COMPOUND, PHOTORESIST RESIN COMPOSITION, AND SEMICONDUCTOR PRODUCTION METHOD" on Jun 25, 2025. With publication no. WO/2026/004902, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NIS...