GENEVA, Aug. 19 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号) filed a patent application (PCT/JP2025/003696) for "COMPOSITION FOR METAL BONDING, METAL PASTE, METHOD FOR PRODUCING BONDED BODY, AND METHOD FOR PRODUCING SINTERED BODY" on Feb 05, 2025. With publication no. WO/2025/169944, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization...