INTERNATIONAL PATENT: DAICEL CORPORATION, 株式会社ダイセル, OSAKA UNIVERSITY, 国立大学法人大阪大学 FILES APPLICATION FOR "ALLOY POWDER, ALLOY PASTE AND SEMICONDUCTOR DEVICE"

Posted On: 2025-03-17

GENEVA, March 17 -- DAICEL CORPORATION (3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka5300011), 株式会社ダイセル (大阪府大阪市北区大深町３番１号), OSAKA UNIVERSITY (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号) filed a patent application (PCT/JP2024/031633) for "ALLOY POWDER, ALLOY PASTE, AND SEMICONDUCTOR DEVICE" on Sep 03, 2024. With publication no. WO/2025/053147, the details related to the patent application was published on ...

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INTERNATIONAL PATENT: DAICEL CORPORATION, 株式会社ダイセル, OSAKA UNIVERSITY, 国立大学法人大阪大学 FILES APPLICATION FOR "ALLOY POWDER, ALLOY PASTE AND SEMICONDUCTOR DEVICE"