GENEVA, June 11 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2024/041765) for "SURFACE-TREATED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD" on Nov 26, 2024. With publication no. WO/2025/115840, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...