GENEVA, July 9 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目1番1号) filed a patent application (PCT/JP2024/046151) for "HOLLOW STRUCTURAL FILM, CIRCUIT BOARD, ANTENNA EQUIPMENT, AND METHOD FOR PRODUCING HOLLOW STRUCTURAL FILM" on Dec 26, 2024. With publication no. WO/2025/143119, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...