INTERNATIONAL PATENT: CXMT CORPORATION, 长鑫科技集团股份有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE AND ELECTRONIC DEVICE"

GENEVA, Dec. 8 -- CXMT CORPORATION (No. 388, Xingye Avenue, Airport Industrial Park, Economic And Technological Development AreaHefei, Anhui 230601), 长鑫科技集团股份有限公司 (中国安徽省合肥市经济技术开发区空港工业园兴业大道388号) filed a patent application (PCT/CN2024/126273) for "PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND ELECTRONIC DEVICE" on Oct 22, 2024. With publication no. WO/2025/246150, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitte...