GENEVA, June 9 -- CSMC TECHNOLOGIES FAB2 CO., LTD. (No.8 Xinzhou Road, Wuxi New DistrictWuxi, Jiangsu 214028), 无锡华润上华科技有限公司 (中国江苏省无锡市新区新洲路8号) filed a patent application (PCT/CN2024/094613) for "TRENCH SUBSTRATE LEAD-OUT STRUCTURE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE" on May 22, 2024. With publication no. WO/2025/112346, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual ...